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product structure silicon monolithic integrated circuit this product is not designed protection against radioactive rays . 1/18 tsz02201-0r2r0g100270-1-2 ? 2012 rohm co., ltd. all rights reserved. 30.oct.2012 rev.002 tsz22111 ? 14 ? 001 www.rohm.com datashee t standard eeproms plug & play eeproms (for display) br24c21xxx series (1k) general description br24c21f,br24c21fj,br24c21fv are serial eeproms that support ddc1 tm /ddc2 tm interfaces for plug and play displays features ? compatible with both ddc1 tm /ddc2 tm ? operating voltage range: 2.5v to 5.5v ? page write function: 8bytes ? low power consumption ? active (at 5v) : 1.5ma (typ) ? stand-by (at 5v) : 0.1a (typ) ? address auto increment function during read operation ? data security ? write enable feature (vclk) ? write protection at low vcc ? initial data=ffh ? data retention: 10years ? rewriting possible up to 100,000 times packages w(typ.) x d(typ.) x h(max.) br24c21xxx series capacity type power source voltage dip-t8 sop8 sop-j8 ssop-b8 1kbit br24c21 2.5v to 5.5v absolute maximum ratings parameter symbol ratings unit remarks supply voltage v cc -0.3 to +6.5 v power dissipation pd 800(dip-t8) mw when using at ta=25 or higher 8.0mw to be reduced per 1 . 450 (sop8) when using at ta=25 or higher 4.5mw to be reduced per 1 . 450 (sop-j8) when using at ta=25 or higher 4.5mw to be reduced per 1 . 350(ssop-b8) when using at ta=25 or higher 3.5mw to be reduced per 1 . storage temperature tstg -65 to +125 operating temperature topr -40 to +85 terminal voltage \ -0.3 to vcc+0.3 v memory cell characteristics parameter limits unit min. typ. max write/erase cycle 100,000 times data retention 10 years sop8 5.00mm x 6.20mm x 1.71mm sop- j8 4.90mm x 6.00mm x 1.65mm dip-t8 9.30mm x 6.50mm x 7.10mm ssop-b8 3.00mm x 6.40mm x 1.35mm downloaded from: http:///
datasheet d a t a s h e e t 2/18 tsz02201-0r2r0g100270-1-2 ? 2012 rohm co., ltd. all rights reserved. 30.oct.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 br24c21xxx series (1k) recommended operating ratings parameter symbol ratings unit supply voltage v cc 2.5 to 5.5 v input voltage vin 0 to vcc electrical characteristics dc (unless otherwise specified, ta=-40 to +85 v cc =2.5v to 5.5v) parameter symbol limits unit condition min. typ. max. h input voltage 1 vih1 0.7v cc - - v scl, sda l input voltage 1 vil1 - - 0.3v cc v scl, sda h input voltage 2 vih2 2.0 - - v vclk l input voltage 2 vil2 - - 0.8 v vclk, v cc 4.0v l input voltage 3 vil3 - - 0.2v cc v vclk, v cc 4.0v l output voltage vol - - 0.4 v sda, iol=3.0ma input leakage current ili -1 - 1 a scl, vclk, vin=0v to v cc output leakage current ilo -1 - 1 a sda, vout=0v to v cc operating current icc - - 3.0 ma v cc =5.5v, fscl=400khz standby current isb - 10 100 a v cc =5.5v, sda=scl=v cc ,vclk=gnd *1 *1 transmit-only mode - after power on, th e br24c21/f/fj/fv is in st andby mode and does not provide th e clock to the vclk pin. after the clock is provided to vclk, the device is switched fr om standby to transmit-only mode, and the operating current flo ws. bi-directional mode - the br24c21/f/fj/fv is in standby mode after each command is performed. ac (unless otherwise specified, ta=-40 to +85 ,v cc =2.5v to 5.5v) parameter symbol fast-mode v cc =2.5v to 5.5v standard-mode v cc =2.5v to 5.5v unit min. typ. max. min. typ. max. clock frequency fscl - - 400 - - 100 khz data clock high period thigh 0.6 - - 4.0 - - s data clock low period tlow 1.3 - - 4.7 - - s sda and scl rise time tr - - 0.3 - - 1.0 s sda and scl fall time tf - - 0.3 - - 0.3 s start condition hold time thd:sta 0.6 - - 4.0 - - s start condition setup time tsu:sta 0.6 - - 4.7 - - s input data hold time thd:dat 0 - - 0 - - ns input data setup time tsu:dat 100 - - 250 - - ns output data delay time(scl) tpd - - 0.9 0.2 - 3.5 s stop condition setup time tsu:sto 0.6 - - 4.0 - - s bus free time tbuf 1.3 - - 4.7 - - s write cycle time twr - - 10 - - 10 ms noise spike width (sda and scl) ti - - 0.1 - - 0.1 s ac operating characteristics (transmit-only mode) output data delay time(vclk) tvpd - - 1.0 - - 2.0 s vclk high period tvhigh 0.6 - - 4.0 - - s vclk low period tvlow 1.3 - - 4.7 - - s vclk setup time tvsu 0 - - 0 - - s vclk hold time tvhd 0.6 - - 4.0 - - s mode transition time tvhz - - 0.5 - - 1.0 s transmit-only powerup time tvpu 0 - - 0 - - s noise spike width (vclk) tvi - - 0.1 - - 0.1 s downloaded from: http:///
datasheet d a t a s h e e t 3/18 tsz02201-0r2r0g100270-1-2 ? 2012 rohm co., ltd. all rights reserved. 30.oct.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 br24c21xxx series (1k) block diagram pin configuration pin descriptions pin name i/o functions v cc - power supply gnd - ground (0v) n.c. - no connection scl in serial clock input for bi-directional mode sda in/out slave and word address, serial data input, se rial data output *1 vclk in clock input (transmit-only mode) write enable (bi-directional mode) *1 an open drain output requires a pull-up resistor. 8 7 6 5 4 3 2 1 sda scl vclk v cc gnd n.c. 1 kbit eeprom array address decoder slave ? word address register data register control logic high voltage v cc level detect 7bit 7bit 8bit ack start stop n.c. n.c. v cc vclk scl sda br24c21 br24c21f br24c21fj br24c21fv gnd n.c. n.c. n.c. (top view) downloaded from: http:///
datasheet d a t a s h e e t 4/18 tsz02201-0r2r0g100270-1-2 ? 2012 rohm co., ltd. all rights reserved. 30.oct.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 br24c21xxx series (1k) synchronous data timing transmit-only mode ? after power is on, the br24c21/f/fj/fv is in transmit-only mode. in this mode data can be output by providing the clock to the vclk pin. ? when the power is on, the scl pin needs to be set to v cc (high level). ? sda is at high-impedance during input of the first 9 clocks. at the 10th rising clock edge of vclk data is output. after power on, the output data is as follows: 00h address data 01h address data 02h address data the address is incremented by one, after every 9 clo cks of vclk. all addresses are output in this mode. when the counter reaches the last address, the next output data is 00h address data. (see figure 4.) ? in this mode, the null bit (high data) is output between the address data and the next address data. (see figure 5.) ? the read operation is in transmit-only mode and can be started after the power is stabilized. a a ii a ii t i aa figure 2. write cycle timing t vhd scl t vsu write command start bit stop bit vclk sda figure 3. write enable timing sda (in) scl sda (out) t hd :sta t hd :dat t su :dat t buf t pd t t high t r t f figure 1. synchronous data timing sda scl t su :sta t su :sto thd:sta start bit stop bit ? sda data is latched into the chip at the rising edge of the scl clock. ? output data toggles at the falling edge of the scl clock. figure 4. transmit only mode figure 5. null bit 10 1 vpu d d d5 d4 d3 vc?k sc? sda vcc 00h address data 9 sda vc?k nu?? bit data=1 d0 d1 d d address n data address n+1 data tvpd tvhigh tv?ow downloaded from: http:///
datasheet d a t a s h e e t 5/18 tsz02201-0r2r0g100270-1-2 ? 2012 rohm co., ltd. all rights reserved. 30.oct.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 br24c21xxx series (1k) bi-directional mode bi-directional mode and recovery function ? the br24c21/f/fj/fv can be switched from transmit-only mode to bi-directional mode by providing a valid high to low transition at the scl pin, while the state of sda is at high-impedance. ? after a valid high to low transition on the scl pin, the br24c21/f/fj/fv begins to count the vclk clock. if the vclk counter reaches 128 clocks without the command for bi-direc tional mode, the device reverts to transmit-only mode (recovery function). the vclk counter is reset by providing a va lid high to low transition at the scl pin. after reversal to transmit-only mode the device begins to output data (00h address data) with the 129th rising clock edge of vclk. ? if the br24c21/f/fj/fv is switched from transmit-only mode and receives the command for bi-directional mode and responds with an acknowledge, it is impossible to revert to transmit-only mode. (power down is the only way to revert to transmit-only mode.) unless the input device code is 1010, the device does not respond with an acknowledge. if the vclk counter reaches 128 clocks afterwards, it is possible to revert to transmit-only mode for recovery function. if the master generates a stop condition during the slave address, before an acknowledge is input, it is possible to revert to transmit-only mode. ? when the device is switched from transmit-only mode to bi-direction mode, the period of tvhz needs to be held. bi-directional mode start condition ? all commands are proceeded by the start condition, which is a high to low transition of sda when scl is high. ? the br24c21/f/fj/fv continuously monitors the sda and scl lines for the start condition and will not respond to any commands until this condition has been met. (see figure 1 synchronous data timing) stop condition ? all commands must be terminated by a stop condition, which is a low to high transition of sda when scl is high. ? the stop condition causes the internal write cycle to write data into the memory array after a write sequence. ? the stop condition is also used to place the device into standby power mode after read sequences. ? a stop condition can only be issued after the transmitting device has released the bus. (see figure 1 synchronous data timing) device addressing ? following the start condition, the master outputs the device address of the slave to be accessed. the most significant four bits of slave address are the device type indentifier, for the br24c21/f/fj/fv this is fixed as 1010. ? the next three bits of the slave address are inconsequential. ? the last bit of the stream determines the operation to be performed. when set to 1, a read operation is selected. when set to 0, a write operation is initiated. r/w set to "0" ? ? ? ? ? ? ? ? write (this bit is also set to "0" for random read operation) r/w set to "1" ? ? ? ? ? ? ? ? read 1010 _ r/w dont care write protect function ? write enable (vclk) when using the br24c21/f/fj/fv in bi-directional mode, the vclk pin can be used as a write enable pin. setting vclk high allows normal write operations, while setting vclk low prevents writing to any location in the array. (see figure 3 write enable timing) changing vclk from high to low during the self-timed program operation will not halt programming of the device. figure 7. mode change ? transmit-oonly / bi-directional transition ?ode with possibility to return to transmit-only ?ode bi-directional parmanently transmit-only bi-directional transition mode with possibility to retune to transmit-only mode bi-directional parmanently * dont care figure 6. recovery mode bi-directional transition ?ode with possibility to return to transmit-only ?ode transmit-only transmit-only address 00h transmit-only address 00h transmit-only bi-directional transition mode with possibility to retune to transmit-only mode downloaded from: http:///
datasheet d a t a s h e e t 6/18 tsz02201-0r2r0g100270-1-2 ? 2012 rohm co., ltd. all rights reserved. 30.oct.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 br24c21xxx series (1k) bidirectional mode command byte write when the master generates a stop condition, the br24c21/f/fj/fv begins the internal write cycle to the nonvolatile array. figure 8. byte write cycle timing page write if the master transmits the next data instead of generating a stop condition during the byte write cycle, the br24c21/f/fj/fv transfers from byte write function to page write function. after receipt of each wor d, the three lower order address bits are internally incremented by one, while the high order four bits of the word address remains constant. if the master transmits more than eight words, prior to genera ting the stop condition, the address counter will roll over, and the previous transmitted data will be overwritten. figure 9. page write cycle timing current read the br24c21/f/fj/fv contains an internal address counter which maintains the address of the last word accessed, incremented by one. if the last accessed address is address n in a read operation, the next read operation will access data from address n+1 and increment the current address counter. if the last accessed address is address n in a write operation, the next read operation will access data from address n. if the master does not transfer an acknowledge, but does generate a stop condition, the curr ent address read operation will only provide a single byte of data. at this point, the device discontinues transmission. (see figure 12 sequential read cycle timing) figure 10. current read cycle timing * * wa 6 d7 1 1 0 0 w r i t e s t a r t r / w a c k s t o p word address data vclk s da line slav e address * wa 0 d0 a c k a c k * *:dont care w r i t e s t a r t r / w a c k s t o p word address 9? 9? data ( n ) vcl k sd a li ne a c k a c k *:dont care a c k slave address 1 1 9? 9? 9? w a 6 d0 d7 d0 wa 0 * aa 9? 9? d7 1 1 0 0 re a d s t a r t r / w s t o p data sda li ne slave adress 9? d0 ac k ac k : t care downloaded from: http:///
datasheet d a t a s h e e t 7/18 tsz02201-0r2r0g100270-1-2 ? 2012 rohm co., ltd. all rights reserved. 30.oct.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 br24c21xxx series (1k) random read the random read operation allows the master to access any memory location. this operation involves a two-step process. first, the master issues a write command that includes the start condition and the slave address field (with r/w set to 0) followed by the word address of the word to be read. this procedure sets the internal address counter of the br24c21/f/fj/fv to the desired address. after the word address acknowledge is received by the master, the master immediately re-issues a start condition followed by the slave address field with r/w set to 1. the device will respond with an acknowledge and then transmit the 8-data bits stored at the addressed location. if the master does not acknowledge the transmission but does generate the stop condition, the ic will discontinue transmission. figure 11. random read cycle timing sequential read if the master does not transfer an acknowledge and does not generate a stop condition during the current read operation, the br24c21/f/fj/fv continues to output the next address data in sequence. for read operations, all bits in the address counter are incremented, allowing the enti re array to be read during a single operation. when the counter reaches the top of the array, it will roll over to the bottom of the array and continue to transmit data. if the master does not acknowledge the transmission but does generate a stop condition, at this point the device discontinues transmission. the sequential read operation can be performed with both current read and random read. figure 12. sequential read cycle timing (current read) i a a a a i a a aa a a a a a a a a a : t care a a a aa a i a a aax a a a : t care downloaded from: http:///
datasheet d a t a s h e e t 8/18 tsz02201-0r2r0g100270-1-2 ? 2012 rohm co., ltd. all rights reserved. 30.oct.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 br24c21xxx series (1k) software reset execute software reset in case the device is at an unexpected state after power up and/or the command input needs to be reset. the following figures (figure 13-(a), figure 13-(b), figure 13-(c)) during dummy clock, please release sda bus (tied to vcc by pull up resistor). during that time, the device may pull the sda line low for acknowledge or outputting read data. if the master controls t he sda line high, it will conflict with the dev ice output low then it makes a current overload. it may cause instantaneous power down and may damage the device. acknowledge polling since the device ignores all input commands during the internal write cycle, no ack will be returned. when the master sends the next command following the write command, and the device returns the ack, it means that the program is completed. if no ack is returned, it means that the device is still busy. by using acknowledge polling, the waiting time is minimi zed to less th an twr=5ms. to prevent operating write or current read immediately after write, first send the slave address (r/w is "high" or "low"). after the device returns the ack, continue word address input or data output, respectively. figure 13-(c) start 9 figure 13-(b) start dummy clock 9 start command command command command command command 1 2 13 14 scl dummy clock 14 start 2 scl scl 1 2 3 8 9 7 2 1 8 9 figure 13-(a) dummy clock 14 start start dummy clock 9 start start start9 sda sda sda word address s t a r t the first write command a c k h a c k l slave address data write command twr twr the second write command s t a r t s t a r t s t a r t s t a r t s t o p s t o p a c k h a c k h a c k l a c k l during the internal write cycle, no ack will be returned. slave address slave address slave address after the internal write cycle is completed ack will be returned (ack=low). then input next word address and data. figure 14. successive write operation by acknowledge polling downloaded from: http:///
datasheet d a t a s h e e t 9/18 tsz02201-0r2r0g100270-1-2 ? 2012 rohm co., ltd. all rights reserved. 30.oct.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 br24c21xxx series (1k) command cancellation by start and stop condition during a command input, command is canceled by the successive inputs of start condition and stop condition (figure 15.). however, during ack or data output, the device may output the sda line low. in such cases, operation of start and stop condition is impossible, making the reset inoperable. execute the software reset in the cases. (figure 13.) operating the command cancel by start and stop condition during the command of random read or sequential read or current read, internal address counter is not confirmed. therefore operation of current read after this is not valid. operate a random read in this case. figure 15. command cancellation i/o circuit sda pin pull-up resister the pull up resister is needed because sda is nmos open drain. choose the correct value of this resister(r pu ), by considering vil, il characteristics of a controller which c ontrol the device and voh, iol characteristics of the device. if large r pu is chosen, clock frequency needs to be slow. in case of small r pu , the operating current increases. maximum rpu maximum value of r pu is determined by following factors: sda rise time determined by r pu and the capacitance of bus line(cbus) must be less than tr. 1) other timing must keep the conditions of ac spec. when sda bus is high, the voltage a of sda bus determined by a total input leak(il) of the all devices connected to the bus. r pu must be significantly higher than the high level input of a controller and the device, including a noise margin 0.2v cc . v cc -ilr pu -0.2 v cc vih r pu 0.8vcc-v ih il examples: when v cc =3v il=10a vih=0.7v cc according to r pu 0.8x3-0.7x3 10x10 -6 300 [k ? ] the capacitance of bus line (cbus) sda pin r pu a il il micro computer figure 16. i/o circuits scl sda 1 1 0 0 start condition stop condition downloaded from: http:///
datasheet d a t a s h e e t 10/18 tsz02201-0r2r0g100270-1-2 ? 2012 rohm co., ltd. all rights reserved. 30.oct.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 br24c21xxx series (1k) minimum r pu the minimum value of r pu is determined by following factors: meets the condition that v olmax =0.4v, i olmax =3ma when the output is low. v olmax =0.4v must be lower than the input low level of the microcontroller and the eeprom including the recommended noise margin of 0.1v cc . volmax vil-0.1 v cc examples: v cc =3v, vol=0.4v, iol=3ma, the vil of the controller and according to 867 r pu 3-0.4 310 -3 the eeprom is vil=0.3v cc , and vol=0.4 v vil=0.3 3 = 0 . 9 v so that condition is met scl pin pull-up resister when scl is controlled by the cmos output the pull-up resistor at scl is not required. however, should scl be set to hi-z, connection of a pull-up resistor between scl and v cc is recommended. several k ? are recommended for the pull-up resistor in order to drive the output port of the microcontroller. notes for power supply v cc rises through the low voltage region in which the internal circuit of the ic and the controller are unstable. therefore, the device may not work properly due to an incomplete reset of the internal circuit. to prevent this, the device has a p.o.r. and lv cc feature. at power up, maintain the following conditions to ensure functions of p.o.r and lv cc . 1. "sda='h'" and "scl='l' or 'h'". 2. follow the recommended conditions of t r , t off , vbot for the p.o.r. function during power up. toff tr vbot 0 fig.33 vcc rising wave from v cc 3. prevent sda and scl from being "hi-z". in case conditions 1 and/or 2 cannot be met, take following actions: a)if unable to keep condition 1 ( sda is "low" during power up): control sda ,scl to be "high" as shown in figure below. tlow tsu:dat tdh a fter vcc becoms stable scl v cc sd a fig.34 scl="h" and sda="l" tsu:dat fi g .35 scl="l" and sda="l" a fter vcc becoms stable b)if unable to keep condition 2. after power becomes stable, execute software reset. (see figure 13.) c)if unable to keep both conditions 1 and 2. follow the instruction a first, then the instruction b. recommended conditions of tr, toff, vbot tr toff vbot below 10ms above 10ms below 0.3v below 100ms above 10ms below 0.2v v cc -v ol r pu i ol r pu v cc -v ol i ol fi g ure 17. fi g ure 18. figure 19. downloaded from: http:///
datasheet d a t a s h e e t 11/18 tsz02201-0r2r0g100270-1-2 ? 2012 rohm co., ltd. all rights reserved. 30.oct.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 br24c21xxx series (1k) lv cc circuit lv cc circuit inhibits write operation at low voltage, and prevents an inadvertent write. write operation is inhibited below the lv cc voltage (typ.=1.2v). vcc noise bypass condenser noise and surges on power line may cause abnormal function. it is recommended that the bypass condensers (0.1f) are attached on the vcc and gnd line beside the device. it is also recommended to attach bypass condensers on the board close to the connector. notes for use 1) described numeric values and data are design representative values, and the values are not guaranteed. 2) we believe that application circuit examples are recommendable, however, in actual use, confirm characteristics further sufficiently. in the case of use by changing the fixed number of external parts, make your decision with sufficient margin in consideration of static characteristics and transition charac teristics and fluctuations of external parts and our lsi. 3) absolute maximum ratings if the absolute maximum ratings such as impressed voltage and operating temperature range and so forth are exceeded, lsi may be destructed. do not impress voltage and temperature exceeding the absolute maximum ratings. in the case of fear exceeding the absolute maximum ratings, take physical safety countermeasures such as fuses, and see to it that conditions exceeding the absolute maximum ratings should not be impressed to lsi. 4) gnd electric potential set the voltage of gnd terminal lowest at any action condition. make sure that each terminal voltages is lower than that of gnd terminal. 5) heat design in consideration of permissible dissipation in actual use condition, carry out heat design with sufficient margin. 6) terminal to terminal shortcircuit and wrong packaging when to package lsi onto a board, pay sufficient attention to lsi direction and displacement. wrong packaging may destruct lsi. and in the case of shortcircuit between lsi terminals and terminals and pow er source, terminal and gnd owing to foreign matter, lsi may be destructed. 7) use in a strong electromagnetic field may cause ma lfunction, therefore, evaluated design sufficiently status of this document the japanese version of this document is formal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority. downloaded from: http:///
datasheet d a t a s h e e t 12/18 tsz02201-0r2r0g100270-1-2 ? 2012 rohm co., ltd. all rights reserved. 30.oct.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 br24c21xxx series (1k) ordering information product code description b r 2 4 c 2 1 x x - x x bus type 24 i 2 c product type capacity 21=1k package blank :dip-t8 f :sop8 fj :sop-j8 fv :ssop-b8 packaging and forming specification none :tube (dip-t8) e2 :embossed tape and reel (sop8,sop-j8, ssop-b8) lineup capacity package type quantity 1k dip-t8 tube of 2000 sop8 reel of 2500 sop-j8 ssop-b8 downloaded from: http:///
datasheet d a t a s h e e t 13/18 tsz02201-0r2r0g100270-1-2 ? 2012 rohm co., ltd. all rights reserved. 30.oct.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 br24c21xxx series (1k) physical dimension tape and reel information dip-t8 ? order quantity needs to be multiple of the minimum quantity. tube containerquantity direction of feed 2000pcs direction of products is fixed in a container tube downloaded from: http:///
datasheet d a t a s h e e t 14/18 tsz02201-0r2r0g100270-1-2 ? 2012 rohm co., ltd. all rights reserved. 30.oct.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 br24c21xxx series (1k) physical dimension tape and reel information - continued sop8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
datasheet d a t a s h e e t 15/18 tsz02201-0r2r0g100270-1-2 ? 2012 rohm co., ltd. all rights reserved. 30.oct.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 br24c21xxx series (1k) physical dimension tape and reel information - continued sop-j8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin downloaded from: http:///
datasheet d a t a s h e e t 16/18 tsz02201-0r2r0g100270-1-2 ? 2012 rohm co., ltd. all rights reserved. 30.oct.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 br24c21xxx series (1k) physical dimension tape and reel information - continued ssop-b8 ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tapequantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) ssop-b8 0.08 m 0.3min 0.65 (0.52) 3.0 0.2 0.15 0.1 (max 3.35 include burr) s s 0.1 1234 5 6 7 8 0.22 6.4 0.3 4.4 0.2 +0.06 0.04 0.1 1.15 0.1 ssop-b8 downloaded from: http:///
datasheet d a t a s h e e t 17/18 tsz02201-0r2r0g100270-1-2 ? 2012 rohm co., ltd. all rights reserved. 30.oct.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 br24c21xxx series (1k) marking diagrams marking information capacity product name marking package type 1k br24c21 dip-t8 c21 sop8 sop-j8 ssop-b8 sop8(top view) part number marking lot numbe r 1pin mark sop-j8(top view) part number marking lot numbe r 1pin mark dip-t8 (top view) part number marking lot number ssop-b8(top view) part number marking lot number 1pin mark downloaded from: http:///
datasheet d a t a s h e e t 18/18 tsz02201-0r2r0g100270-1-2 ? 2012 rohm co., ltd. all rights reserved. 30.oct.2012 rev.002 www.rohm.com tsz22111 ? 15 ? 001 br24c21xxx series (1k) revision history date revision changes 10.jul.2012 001 new release 30.oct.2012 0002 p10 the expression of is corrected figure 17, figure 18 and figure 19 is corrected downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific appl ications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from th e use of any rohms products under any special or extraordinary environments or conditions. if yo u intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docum ent are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate i f the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or you r customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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